IntEgreat – Sustainable PCB integration Through 3D overprinting
Integration of electronic subsystems into industrial components enables us to get toward digital transformation. A sustainable way of covering printed circuit boards (PCBs) is 3D overprinting. It enables attractive design options, the use of advanced sustainable materials, and a reduction of waste compared to subtractive production processes. The project aims to overprint PCBs via Fused Deposition Modelling (FDM) and to consider a recycling procedure to separate electronics from the carrier material.